1、Chip Cleaner HF-CC-05A
With the continuous development of Ultra-Large Integrated Circuits (ULIC), the line width of chips is constantly shrinking, and the requirements for chip surface cleanliness are becoming increasingly stringent, such as particulate contaminant control, metal ion content limitation, organic residue control, surface chemical state requirements, and cleaning uniformity requirements. is specially developed to meet this demand. It can effectively remove contaminants such as wax, polishing fluid, oxide film, residual metal particles, polishing powder, metal ions, and silicon crystal powder particles on the chip surface after thinning, grinding, polishing, or dicing. It significantly improves chip surface cleanliness, for example, mitigating the defect of "adhesive vapor pollution" and ensuring uniform coating and good adhesion of materials in subsequent processes such as thin film deposition and photolithography.If cleaning is incomplete, residual impurities may reduce chip reliability and even cause electrode corrosion. 2、Features
 •Environmentally Friendly and Safe: No pungent odor, non-toxic, non-flammable, and non-corrosive to chips (such as Indium Tin Oxide (ITO), Gallium Arsenide (GaAs), Gallium Nitride (GaN), Indium Phosphide (InP), aluminum, copper, iron, nickel, etc.), with excellent biodegradability.
 •Efficient Cleaning: It has strong penetrating and dissolving power, fast cleaning speed, no residue, and easy rinsing. For example, in cleaning after thewafer backside thinning process and wafer dicing, it can thoroughly removetemporary fixing wax on the chip surface, various metal ions, particulateimpurities (such as grinding particles and silicon powder), organic residues,additives in the grinding fluid, photoresist, etc., ensuring uniformcleaning ofthe entire chip surface.
•A perfect Alternative to Acetone: Can replace acetone for dissolving temporaryfixing wax (e.g., SHIFTWAX 7607), eliminating the flammable and explosivesafety hazards caused by acetone while providing a favorable workingenvironment.
 •Reducing Adhesive Vapor Pollution: By improving chip surface cleanliness, it can mitigate the issue of "adhesive vapor pollution" to a certain extent.
 •Ensuring Stable Chip Surface Performance: No physical damage or chemical corrosion to the chip surface, maintaining the surface flatness and integrity of the chip to avoid affecting its electrical performance and reliability.
 •Application Scope: Suitable for ultrasonic cleaning method, with an optimaloperating temperature of 45°C to 55°C.
3、Physical and chemical properties
 •Appearance: pale yellow clear liquid
 •Odour: Odorless or very mild
 •PH: 9.0±0.5
 •Density: 0.9550---0.9950g/cm3
 •Rinsability: very good
 •Recommended dilutent: DI water
4、storage
 •be stored indoors where it is cool and dry and be kept tightly sealed after each time opened and avoid overheat, incompatible with strong oxidizer and acids.
 •Shelf life : one years in its original packaging
6、Recommended Cleaning Process

Cleaning		Rinsing			Drying
Bank 1#HF-CC-05ATemp : 50士5℃Time:6 MUltrasonic+Swing	Bank 2# HF-CC-05A Temp:50+5 Time: 6 M Ultrasonic Swing	Bank 3# QDR Room temperature	Bank 4#QDRRoom temperature	Bank 5# IPA Room temperature	Bank 6# Spin Dry

7、Package
Plastic barrel with HDPE rather than iron/galvanized materials is surely used, 200 liters or 25 liters available
8、Storage and transportation
Due to being non-toxic and non-flammable, it can be handled according to regulations on the transport of the general chemicals.
Be stored indoors where it is cool, dry, and well ventilates,.
And be kept tightly sealed each time opened, and avoid overheat and sunlight and raining, incompatible with strong oxidizer and acidic materials.
9、Shelf life
One year in its original packaging
8、Delivery lead time
15 work days when PR is received.